Qsop Package

The ground pad on the PCB should match the size of the exposed paddle of the package and should be Solder Mask Defined (SMD). Temperature range is -40 to 125 °C. Classification Major Minor Products Affected M02042G-4D03-T M02042G-4D03A-T M02042-3A03-T M02044CG-03-T. universal adapter, assigned for QSOP devices up to 24 pins (for example Holtek HT46, HT48 series, Cypress CY7Cxxxxx series, Sonix SN8P22000, SNP25000,. These are useful for modding and upgrading devices that use 16-pin DIP ICs, when the upgraded IC is only available in a SSOP footprint. QSOP Mechanical Specifications PACVGA105 devices are packaged in 16-pin QSOP packages. QSOP-20 PACKAGE INFORMATION Mechanical Data Surface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0. The previous part number of this socket was 28QN65T16060. The MAX11626-MAX11629 are available in 16-pin QSOP packages. Visit to know long meaning of QSOP acronym and abbreviations. Buy SN74FLS273DWR TI Other Components, View the manufacturer, and stock, and datasheet pdf for the SN74FLS273DWR at Jotrin Electronics. By our unique designed assembly process, we are able to provide ISO 9001:2015 certified Printed Circuit Board manufacturing and assembly services for prototype and low-volume to mid-volume orders at low cost. Turn-key PCB assembly is our specialty. Coupler MODELS. WARPAGE SHALL NOT EXCEED 0. The EL5108 is offered in the 6-pin SOT-23 and the industrystandard 8-pin SO packages and the EL5308 is available in the 16-pin SO and 16-pin QSOP packages. QSOP Pin count: 16-24 pins Body Length: 4. MMT's main production area houses probe, assembly, and final test. 3 V Qsop-24 Rohs Ics Digital To Analog Converters (dacs) Max5181beeg+ , Find Complete Details about 10 1 Current-unbuffered Parallel 2. 5-1mm beyond the standard size. MAX8764EEP+T – - Controller, Notebook Power System Voltage Regulator IC 1 Output 20-QSOP from Maxim Integrated. Quarter Size Outline Package listed as QSOP. IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package. Enter a package ID or package type to search IDT's database. The SparkFun 16-Pin SSOP to DIP Adapter is a small PCB that lets you adapt 14 and 16-pin SSOP packages to a DIP footprint. Enter the terms you wish to search for. Typical applications. SMT to Thru-hole Adapter for QSOP - 300 MIL wide DIP plug,. This package has pins on bothe sides, alot like the TSOP. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Manufacturer. There are generally two widths for this package, one wide and one narrow. The only way to tell is to line two drawings up side by side and compare the dimensions. 24-lead qsop package wide power input voltage range. QSOP stands for Quality Small Outline Package. Buy RF SOLUTIONS ZETA-COD-QSOP online at Newark. Chip carrier. The MAX1672 comes in a 16-pin QSOP package (same size as a standard 8-pin SO). The EL5108 is offered in the 6-pin SOT-23 and the industrystandard 8-pin SO packages and the EL5308 is available in the 16-pin SO and 16-pin QSOP packages. DIP Package styles; QSOP [DIP], SOIC-N, SOIC-W, PDIP, Gull Wing BGA packages are also available as resistor networks. Leadless chip carriers have metal pads on the edges. SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go and there is no standard naming convention. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. SSOP/SOP/QSOP Tape & Reel Service Offered by NPI Materials. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. com! 'Quarter Size Outline Package' is one option -- get in to view more @ The Web's largest and most authoritative acronyms and abbreviations resource. SWR6G/Rxxx High performance buss termination network SWR6G/Rxxx is pin compatible with PACR6G Specially applicable for Pentium or P6-class computer/servers 18 terminating lines/package Center ground pin placement reduces ground bounce High speed. pls confirm for Thermal pad issue for QSOP-16 package. This tutorial presents the theoretical basis for analog switches and describes some common applications for standard types. Surface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0. A unique ceramic/polymer composite barrier provides excellent. 8-bit parallel dac in qsop-16 package 4 _____ wr l l h x x h cs max5480 10pf vout 16 15 14 vref vdd r2 1k r1 2k d7–d0 cs out1 12 data inputs 4–11 13 out2 1 2 wr r1 and r2 used only if gain adjustment is required. Order today, ships today. I can't find the exact package drawing. This device is packaged in a 16leaded QSOP plastic surface mount package. QSOP: Quarter-Size Small-Outline package, with pin spacing of 0. Microchip's Focus Product Selector Guide includes information on specific packages that are available for each product. Title: Package dimensions MSOP, SSOP, TSSOP-A2. SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package: TSOP: Thin small-outline package: Example TSSOP. Get the latest IC package info. Footprint Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO). Logical Systems IC Adapters for Programming, Emulators, Prototyping and IC Package Coversion. Coupler MODELS. Abstract: No abstract text available Text: Package Outline 44-Lead QSOP Package Outline (QP) 17. Please review product page below for detailed information, including NT20045-QSOP-TR price, datasheets, in-stock availability, technical difficulties. "T" and "V" Series parts have a maximum operating temperature of 125°C. Pin Assignments 16 pin. SYMBOL A B C D E F G G1 H J K L M MIN 8. QSOP: The Quarter Size Outline Package. Potato Semiconductor - Active Parts IBS Electronics Global Electronics Parts and Components Distributor Search, Find, Buy electronic components, electronic parts, electronic supplies, mechatronic, embedded hardware from manufacturer authorized electronic component distributor featuring cross reference, datasheets, catalog, retail, wholesale outlet. WARPAGE SHALL NOT EXCEED 0. The A3935 is supplied in either a 44- lead plastic PLCC with four copper batwing tabs for maximum heat dissipation or in a 36-lead QSOP package. saving 4 mm x 4 mm 20-QFN and a 24-QSOP package, or three clock outputs offered in a 10-MSOP package. 3V PGND 3 12 9 14 6 16 7 5 11 2 8. indd Created Date: 8/4/2006 1:07:11 PM. 24 Lead QSOP Package Electrical Specifications I, T A = +25°C, For TTL Control and V DD = +5V in a 50 Ohm System Typical Applications The HMC252QS24 / HMC252QS24E is ideal for: • Base Station • CATV / DBS • MMDS & WirelessLAN • Test Equipment The HMC252QS24 & HMC252QS24E are low-cost non-reflective SP6T switches in 24-lead QSOP. DIP Package styles; QSOP [DIP], SOIC-N, SOIC-W, PDIP, Gull Wing BGA packages are also available as resistor networks. Keyphrases. Brand new high-quality products MAX5907EEE+(Maxim Integrated/16-SSOP (0. For complete information on the QSOP-16 package, see the California Micro Devices QSOP Package Infor-mation document. 24 Lead QSOP Package. 文档标题 他の言語 文档类型 文档格式 文件大小 日; pcn / pdn: pdn# : u-10-17 product discontinuance notice for selective mc clock devices. Other Meanings of QSOP As mentioned above, the QSOP has other meanings. " - Albert Einstein. Quarter Size Outline Package Academic & Science » Electronics. 1015Gaas MMIC sP8T NON-REFLECTIVEsWITCH, DC - 2. Product Category. QSOP - Quarter Size Outline Package. • Laser mark on package body DS360O Rev Date: 12/17 SSOP/QSOP Shrink Small Outline, Quarter-Size Small-Outline Packages (SSOP/QSOP) SSOP and QSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. 3 V Single-Channel RS-232 Line Driver/Receiver -- ADM3101EACPZ-250R7 from Analog Devices, Inc. For pin-compatible. For 28 pin QSOP package 3. Footprints and parts for Open Ephys designs. In your case I think the probability is small that they are the same, but I could be wrong. 50mm body, 2. SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package: TSOP: Thin small-outline package: Example TSSOP. QSOP is defined as Quarter Small Outline Package somewhat frequently. QSOP Pin count: 16-24 pins Body Length: 4. The MICRF229 is a 400MHz to 450MHz super-heterodyne, image-reject, RF receiver with automatic gain control, ASK/OOK demodulator, and analog RSSI output. Recent data generated by Texas Instruments (TI ) linear and logic Recent data generated by Texas Instruments (TI ) linear and logic package designers includes θ JA and θ JC measured, or modeled, on both a JEDEC low-thermal-conductivity (low K) PCB. For Q2: Yes, the insulation test voltage( 3600Vrms) for 1 second is applied between side 1 and side 2 during 100% production test. PCB technology improvements have allowed the package pin pitch to be reduced further as shown in the comparison between the Small Outline IC (SOIC) and the Quarter Size Small Outline Package (QSOP) in Figure 3-11. QSOP-16 to DIP-16 IC Adapter Converting QSOP 16 pins (0. Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. The device is offered in a small footprint surface mount package that allows easy implementation in customer applications. QSOP - Quarter Size Outline Package. Development Boards, Kits, Programmers – Evaluation Boards - Op Amps are in stock at DigiKey. Package Structure. 81 mm SQ Body, 0. cn(需要重新注册) 如果需要转移工程请在个人中心. The only way to tell is to line two drawings up side by side and compare the dimensions. Enter the operating current (in mA): Step 9. com Vishay Dale Thin Film Revision: 24-Aug-17 1 Document Number: 60034 VSSRC 20 PIN QSOP 16 mm 2500 400 mm 0. •Small Package (16-pin QSOP) APPLICATIONS •Faders •Panners •Compressors & Limiters •Gates & Expanders •Mixers •Equalizers •Filters •Oscillators THAT 2162 NC 16 OUT 2 15 SYM 2 14 Ec- 2 13 V CC 12 Ec+ 2 11 IN 2 10 NC 9 GND 8 IN 1 7 Ec+ 1 6 V EE 5 Ec- 1 4 SYM 1 3 OUT 1 2 NC 1 Pin Name Pin Number Table 1. “If I had an hour to solve a problem I’d spend 55 minutes thinking about the problem and 5 minutes thinking about solutions. SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise speciied) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5. pcn dsg/03/380 dsg-discretes & standard ic s- leadfree plating for sop, tssop, ssop, qsop packages. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of. 635mm, IPC Medium Density. packages: QSOP24, SO-24, TSSOP-24 and HTSSOP-24 (with exposed pad). D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. and QSOP packages offer unprecedented miniaturization. i have successfully soldered a handful of ethernet controller chips in the QFN package with this method, but it wasnt easy. Title: 24 Lead TSSOP Author: Dallas Semiconductor Corp Subject: Mechanical Drawings Keywords: Mechanical Drawings Created Date: 3/23/1998 8:52:33 AM. 94mm (155 mil) component body width Pitch 0. QSOP is a package with a compressed body size and a finer lead pitch in order to obtain smaller versions of the standard SOIC package. Keyphrases. The MAX11606-MAX11611 are guaranteed over the extended temperature range (-40°C to +85°C). 1 mm greater than the package pad length, with the extra area on the outside of the package (see Figure 7 for example). The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. The Quarter Size Outline Package, or QSOP, is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides. 2 inch package seldom shows up in the west but is/was very popular in Japan, so beware if you buy chips from Asian sellers on Ebay. 00watt / QSOP Maximum Operating Voltage 50V Operation Temperature -55 ℃ ~ 125 Storage Temperature -65 ℃ ~ 150 R pin # 24 pin # 1 1. Abstract: No abstract text available Text: Package Outline 44-Lead QSOP Package Outline (QP) 17. Image Abbrv Full Name JEDEC/JEITA SOIC-N-EP SOIC narrow body with exposed pads with heatsink batwing SOIC, SOIC-BAT: SOIC thermally enhanced with fused leads (batwings). Official website of the World Series of Poker Tournament. 007 CAB L1 MDP0040 QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY SYMBOL INCHES. 2009 - 44-lead QSOP Package Outline. 30mm(tssop) to (. Compare [object Object] vs [object Object] Risk Rank, Pbfree Code, Rohs Code, Part Life Cycle Code, Ihs Manufacturer, Part Package Code, Package Description, Pin Count, ECCN Code, HTS Code, Family, Input Conditioning, JESD-30 Code, JESD-609 Code, Length, Logic IC Type, Max I(ol), Moisture Sensitivity Level, Number of Functions, Number of Inverted Outputs, Number of Terminals. QSOP Package Dimensions QSOP Package Power Temperature Derating Curve Typical Part Marking WATTS AMBIENT TEMPERATURE ( C )° 1. Package Structure. Potato Semiconductor - Active Parts IBS Electronics Global Electronics Parts and Components Distributor Search, Find, Buy electronic components, electronic parts, electronic supplies, mechatronic, embedded hardware from manufacturer authorized electronic component distributor featuring cross reference, datasheets, catalog, retail, wholesale outlet. SYMBOL A B C D E F G G1 H J K L M MIN 8. Multiple invoices can be paid in one transaction. com Vishay Dale Thin Film Revision: 24-Aug-17 1 Document Number: 60034 VSSRC 20 PIN QSOP 16 mm 2500 400 mm 0. Block Diagram High-speed operation DC to 150 Mbps 15 µs startup time Wide Operating Supply Voltage: 2. 81 mm SQ Body, 0. 28-pin QSOP Package 16-pin QSOP Package 16-pin QSOP Package VCA RMS 4320N 24-pin QFN package THAT Corporation, Rev 01 Analog Engine Pinouts VCA RMS. Typical values are measured at 9600 baud at TA = +25°C. Click the products below for data sheets and ordering information. Buy your ZETA-COD-QSOP from an authorized RF SOLUTIONS distributor. ref rfb gnd 3 vdd max4330 figure 1. Layout may vary. ipc-7351 all soic sop hsop qsop msop vsop tvsop ssop tssop 250 packages: description: tssop10 tssop-10 ssop10 ssop-10 sop10 sop-10 soic10 soic-10 tssop14 tssop-14 ssop14 ssop-14 sop14 sop-14 soic14 soic-14 tssop16 tssop-16 ssop16 ssop-16 sop16 sop-16 soic16 soic-16 tssop18 tssop-supplier part number:. Product Details. Widest selection of daisy chain IC packages, practice kits and supplies for micro-electronics. 00watt / QSOP Maximum Operating Voltage 50V Operation Temperature -55 ℃ ~ 125 Storage Temperature -65 ℃ ~ 150 R pin # 24 pin # 1 1. Typical applications. I can't find the exact package drawing. marking is for package orientation reference only. For pin-compatible 12-bit parts, refer to the MAX11612-MAX11617 data sheet. Looking for the definition of QSOP? What does QSOP stand for? Find out it here! 9 meanings for QSOP abbreviations and acronyms on acronymsandslang. SWR6G/Rxxx High performance buss termination network SWR6G/Rxxx is pin compatible with PACR6G Specially applicable for Pentium or P6-class computer/servers 18 terminating lines/package Center ground pin placement reduces ground bounce High speed. SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise speciied) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5. 3 ALERT Comp Open-Drain Active Low Output. 81 mm SQ Body, 0. 你现在访问的是EasyEDA海外版,使用建立访问速度更快的国内版 https://lceda. 635mm pin spacing) TSSOP (Thin Shrink Small Outline Package)-QSOP (Quarter-size Small Outline Package) - (0. Package Dimensions for QSOP-16 PACKAGE DIMENSIONS. A unique ceramic/polymer composite barrier provides excellent. SMT packages are used for most printed circuit designs that are going to be manufactured in any quantity. QSOP definition / QSOP means? The Definition of QSOP is given above so check it out related information. TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: Info ©2018 TopLine. Buy your ZETA-COD-QSOP from an authorized RF SOLUTIONS distributor. Multiple invoices can be paid in one transaction. rogales Created Date: 2/7/2017 2:29:36 PM. " - Albert Einstein. BibTeX @MISC{Package09reset, author = {Small -lead Qsop Package and V Cc and Fan Min and Speed Register and Address Pointer and Speed Register and Speed Register and Fan Speed}, title = {RESET}, year = {2009}}. Options include small outline packages such as wafer level chipscale (CSP), Ultra-Dual Flat No Lead (UDFN), Ultra-Quad Flat No Lead (UQFN), plastic Shrink Small Outline (SSOP), plastic Think Shrink Small Outline (TSSOP), plastic Small Outline (SOIC), Thin Quad Flat Pack (TQFP), Ball Grid Array (BGA), and Plastic Dual In-Line (PDIP). Acomparison of four surface mount packages and one DIPis shown in Figure 3-10. The IL41050 family provides isolated differential transmit capability to the bus and isolated differential receive capability to the CAN controller via NVE's patented* IsoLoop spintronic Giant Magnetoresistance (GMR) technology. The part number has changend. MSI installer for Visio 2003, 2007, 2010, 2013, 2016 and 2019. ADuM140x. 16 9 8 1 SEATING PLANE 0. You can click links on the left to see detailed information of each definition, including definitions in English and your local language. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of. 635 mm ; VSOP - Very Small Outline Package. MAX548 Datasheet, MAX548 PDF, MAX548 Data sheet, MAX548 manual, MAX548 pdf, MAX548, datenblatt, Electronics MAX548, alldatasheet, free, datasheet, Datasheets, data. Typical applications. 9; soic (8-20l); qsop (16-30l); tssop (8-28l, 173 mils); wide-tssop (28l); wide tssop (56l); msop (8l); mlp, dfn, qfn (3×3. 9mm, Pitch 0. The EL5106 is offered in the 6-pin SOT-23 and the industrystandard 8-pin SO packages and the EL5306 is available in the 16-pin SO and 16-pin QSOP packages. Coupler products and is a configurable board that can be adapted to many. IC Package Design Information | Maxim Integrated. This package has pins on bothe sides, alot like the TSOP. 635mm Pitch PCG16D1, PSC-4750-01, Rev 00, Page 2 Package Revision History Date CreatedRev No. Package Information Package Name SOP8 Type SOP Pin Count 8 Outline Dimension Drowing No. Options include small outline packages such as wafer level chipscale (CSP), Ultra-Dual Flat No Lead (UDFN), Ultra-Quad Flat No Lead (UQFN), plastic Shrink Small Outline (SSOP), plastic Think Shrink Small Outline (TSSOP), plastic Small Outline (SOIC), Thin Quad Flat Pack (TQFP), Ball Grid Array (BGA), and Plastic Dual In-Line (PDIP). 635 mm이며, 경우에 따라서 0. Two speed grade options (1 and 150 Mbps) are available and achieve worst-case propagation delays of less than 10 ns. QSOP (25mil pitch) Shrink Small Outline, 150 mil body, 25 mil pitch. ©2002 Fairchild Semiconductor Corporation August 2002, Rev. Mouser offers inventory, pricing, & datasheets for Sockets & Adapters. The bottom part (SMT base), is surface mounted to the PCB and replaces the component normally soldered to the PCB card solder pads. Quarter Size Outline Package listed as QSOP. What does QSOP stand for? All Acronyms has a list of 15 QSOP definitions. Chip-on-Board and Chip-on-Flex Assemblies Lead-free and Green Processes and Materials: Factory Address 45 Moo 12, Rojana Industrial Park Thambon Thanu Amphur U-Thai. Mechanical drawings for some of the devices were removed from the web site because of bandwidth issues. This tutorial presents the theoretical basis for analog switches and describes some common applications for standard types. What does QSOP mean? is explained earlier. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Find Qsop Adapter related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of Qsop Adapter information. QSOP Package Power Temperature Derating Curve Schematic Narrow-Body SOIC Package Power Temperature Derating Curve Standard Resistance Values Typical Part Marking 8 PIN 14 PIN 16 PIN 20 PIN 24 PIN 28 PIN R1 R3 R5 R7 R9 R11 R13 R15 R17 R19 R21 R23 R25 R27 R2 R4 R6 R8 R10 R12 R14 R16 R18 R20 R22 R24 R26 Represents total content. Looking to save space and power in your circuit design? The VSSR1603220JUF resistor array from Vishay gives you a solution by combining multiple resistors into a single chip. In your case I think the probability is small that they are the same, but I could be wrong. UTAC Holdings is a leading provider of assembly and test services for semiconductor chips with diversified end uses, including devices such as in-communications, consumer, computing, automotive, security, and industrial and medical applications. Description Jan 29, 2018 Rev 00Revised from PSC-4040 PCG16. QFP- Quad flat pack: The QFP is the generic type of flat package for surface mount ICs. The evaluation board supports the common pad positions for power, ground, and I/O pins found in nearly all of the. QSOP - Quarter-size Small Outline Package: It has a pin spacing of 0. QFP- Quad flat pack: The QFP is the generic type of flat package for ICs. Find a number of IC Packaging Design on part numbers, board designs, lead-free and cross-refercing. For complete information on the QSOP-16 package, see the California Micro Devices QSOP Package Infor-mation document. "If I had an hour to solve a problem I'd spend 55 minutes thinking about the problem and 5 minutes thinking about solutions. SUPPORTED. SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise speciied) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5. Maxim Integrated MAX5158CEE: 5,632 available from 8 distributors. 28 Pin Closed top test socket, QFN type package dual pin contact test socket. Find Qsop Adapter related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of Qsop Adapter information. Step 1: Invoice / Engagement Information. Looking for the definition of QSOP? What does QSOP stand for? Find out it here! 9 meanings for QSOP abbreviations and acronyms on acronymsandslang. pretty development by creating an account on GitHub. 16-QSOP Package Outline Drawing 3. Requires a pullup resistor. i need the footprint for the part MAX1668MEE+ to verify. Email to friends Share on Facebook - opens in a new window or tab Share on Twitter - opens in a new window or tab Share on Pinterest - opens in a new window or tab. The device is offered in a small footprint surface mount package that allows easy implementation in customer applications. 80 mm MO-150 P1 32289. Shrink Small Outline Package footprints. TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: Info ©2018 TopLine. QFP - Quad Flat Package. 94mm (155 mil) component body width Pitch 0. Widest selection of daisy chain IC packages, practice kits and supplies for micro-electronics. There are generally two widths for this package, one wide and one narrow. Every IC manufacturer has names for packages and they don't always matchup. MAX3140CEI+T - RS232, RS485 Controller SPI, UART Interface 28-QSOP from Maxim Integrated. Multiple invoices can be paid in one transaction. SOP SOIC Is there any important differences between these two packages th Stack Exchange Network Stack Exchange network consists of 175 Q&A communities including Stack Overflow , the largest, most trusted online community for developers to learn, share their knowledge, and build their careers. WARPAGE SHALL NOT EXCEED 0. a = +25° C, For TTL Control and Vdd = +5V in a 50 Ohm system. 30mm(tssop) to (. SMD and Component Package SMD is " Surface Mount Device " it is the SMT electronic components which mount by surface mounting machine or placement machine , for the example as Resistor, Capacitor, Diode, Transistor, BGA, IC each package (SOP, SOIC, SOT, PLCC, etc. •Small Package (16-pin QSOP) APPLICATIONS •Faders •Panners •Compressors & Limiters •Gates & Expanders •Mixers •Equalizers •Filters •Oscillators THAT 2162 NC 16 OUT 2 15 SYM 2 14 Ec- 2 13 V CC 12 Ec+ 2 11 IN 2 10 NC 9 GND 8 IN 1 7 Ec+ 1 6 V EE 5 Ec- 1 4 SYM 1 3 OUT 1 2 NC 1 Pin Name Pin Number Table 1. Pin description. It's possible to get the same part in various widths - 0. devices are available in QSOP packages. SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise speciied) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5. ref rfb gnd 3 vdd max4330 figure 1. Quik-Pak can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of. The PCB land length should be 0. QSOP - Quarter Size Outline Package. SYMBOL A B C D E F G G1 H J K L M MIN 8. An IP package [In-line package] is a rectangular package having one row (or two or more parallel rows) of terminals oriented perpendicular to the package seating plane. Detailed packaging information can be found in the Package Drawing and Dimensions Specification. LAPIS Semiconductor excels in a number of technologies, including low power consumption, digital-analog mixed signals, high-frequency circuits and memory design, and provides logic LSIs, memory LSIs, display driver LSIs, and foundry services. QSOP stands for Quarter Size Outline Packages. i need the footprint for the part MAX1668MEE+ to verify. Carsem's patented FCOL (Flip Chip On Leadframe) is the process of flipping a bumped die onto a lead frame and then molding it using standard plastic package assembly processes. Abstract: No abstract text available Text: Package Outline 44-Lead QSOP Package Outline (QP) 17. MSI installer for Visio 2003, 2007, 2010, 2013, 2016 and 2019. For pin-compatible 12-bit parts, refer to the MAX11612-MAX11617 data sheet. Get the latest IC package info. Featuring poker tournament coverage of events, schedules and news. SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise speciied) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5. 635 mm VSOP - Very Small Outline Package: This is smaller than the QSOP and has pin spacing of 0. •Small Package (16-pin QSOP) APPLICATIONS •Faders •Panners •Compressors & Limiters •Gates & Expanders •Mixers •Equalizers •Filters •Oscillators THAT 2162 NC 16 OUT 2 15 SYM 2 14 Ec- 2 13 V CC 12 Ec+ 2 11 IN 2 10 NC 9 GND 8 IN 1 7 Ec+ 1 6 V EE 5 Ec- 1 4 SYM 1 3 OUT 1 2 NC 1 Pin Name Pin Number Table 1. Note: This category is a catch all for domestic and international derivatives of the basic small outline package. 8-bit parallel dac in qsop-16 package 4 _____ wr l l h x x h cs max5480 10pf vout 16 15 14 vref vdd r2 1k r1 2k d7-d0 cs out1 12 data inputs 4-11 13 out2 1 2 wr r1 and r2 used only if gain adjustment is required. The device is offered in a small footprint surface mount package that allows easy implementation in customer applications. Table 1: Device summary Order code Package Packing STP16CPC26MTR SO-24 1000 parts per reel STP16CPC26TTR TSSOP24 2500 parts per reel STP16CPC26XTR TSSOP24 exposed pad 2500 parts per reel STP16CPC26PTR QSOP-24 2500 parts per reel. There are generally two widths for this package, one wide and one narrow. QSOP (25mil pitch) Shrink Small Outline, 150 mil body, 25 mil pitch. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other ADCs products. MAX3140CEI+T - RS232, RS485 Controller SPI, UART Interface 28-QSOP from Maxim Integrated. Product Category. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Note: This category is a catch all for domestic and international derivatives of the basic small outline package. PCB technology improvements have allowed the package pin pitch to be reduced further as shown in the comparison between the Small Outline IC (SOIC) and the Quarter Size Small Outline Package (QSOP) in Figure 3-11. What does QSOP stand for? All Acronyms has a list of 15 QSOP definitions. SSOP (Shrink Small Outline Package) and QSOP (Quarter‑Size Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. BibTeX @MISC{Package09reset, author = {Small -lead Qsop Package and V Cc and Fan Min and Speed Register and Address Pointer and Speed Register and Speed Register and Fan Speed}, title = {RESET}, year = {2009}}. QSOP package contains thermal pad or not. Package Structure. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining standard WB SOIC-16 package dimensions and land pattern. 8-bit parallel dac in qsop-16 package 4 _____ wr l l h x x h cs max5480 10pf vout 16 15 14 vref vdd r2 1k r1 2k d7-d0 cs out1 12 data inputs 4-11 13 out2 1 2 wr r1 and r2 used only if gain adjustment is required. SSOP (축소된 소형 패키지, shrink small-outline package) - 핀간격은 0. and QSOP packages offer unprecedented miniaturization. The part number has changend. You can also use it for prototyping, to. The QSOP comes in two standard body widths: the narrow body QSOP which has a nominal body thickness of 150 mils and the wide body QSOP which has a nominal body thickness of 300 mils. 74 mm Find the right package within TI’s wide range of advanced packaging solutions TI university program. The ground pad on the PCB should match the size of the exposed paddle of the package and should be Solder Mask Defined (SMD). iC-Haus Application Guide More Package Info. The device contains a 16-bit shift register and data latches, which convert serial input data into parallel output format. PLCC - Plastic Leaded Chip Carrier. 010 CAB SEATING PLANE DETAIL X E E1 1 (N/2) N (N/2)+1 PIN #1 I. For price, delivery, and to place orders: Analog Devices, Inc. devices are available in QSOP packages. All three of these low cost ICs operate from a 3 V power supply and are provided in small QSOP plastic packages. QSOP 20 Standard Packages Pin No. LCC, PLCC, PQFP. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other ADCs products. Wide power input voltage range: 1 V to 24 V. The ACS764 is provided in a compact 24-pin QSOP package (suffix LF). The MICRF229 is a 400MHz to 450MHz super-heterodyne, image-reject, RF receiver with automatic gain control, ASK/OOK demodulator, and analog RSSI output. Quickly Enter the access of compare list to find replaceable electronic parts. SPI/Microwire-Compatible UART in QSOP-16 2 _____ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VCC = +2. Features • Fully differential inputs, outputs, and feedback • Differential input range ±2. The PCB land length should be 0. The ACS709 consists of a precision linear Hall sensor integrated circuit with a copper conduction path located near the surface of the silicon die. The device contains a 16-bit shift register and data latches, which convert serial input data into parallel output format. V20 11 M/A-COM Technology Solutions Inc. Layout may vary. QSOP is defined as Quality Small Outline Package very rarely. Pin description. Later packaging forms have all kinds of advantages like being cheaper per pin, wasting less PCB area, being more easily handled by pick and place machines etc. SMD and Component Package SMD is " Surface Mount Device " it is the SMT electronic components which mount by surface mounting machine or placement machine , for the example as Resistor, Capacitor, Diode, Transistor, BGA, IC each package (SOP, SOIC, SOT, PLCC, etc. Product Category. Highly efficient LED drivers provide optimal performance in general lighting applications and in LED backlighting systems for large flat display panels. I can't find the exact package drawing. Classification Major Minor Products Affected M02042G-4D03-T M02042G-4D03A-T M02042-3A03-T M02044CG-03-T. Package Information Package Name SOP8 Type SOP Pin Count 8 Outline Dimension Drowing No. SOIC - Small-Outline Integrated Circuit. 文档标题 他の言語 文档类型 文档格式 文件大小 日; pcn / pdn: pdn# : u-10-17 product discontinuance notice for selective mc clock devices. Get the latest IC package info. ADuM140x. Adafruit Industries, Unique & fun DIY electronics and kits SMT Breakout PCB for SOIC-16 or TSSOP-16 - 3 Pack! ID: 1207 - Beguiled by a fancy new chip that is only available in a SOIC or (T)SSOP pinout?. QSOP - Quarter-size Small Outline Package: It has a pin spacing of 0. 3 V power supply. Package Dimensions for QSOP-16 PACKAGE DIMENSIONS. The evaluation board supports the common pad positions for power, ground, and I/O pins found in nearly all of the. Silicon Laboratories SI5351B Manuals Package Outline (24-Pin QSOP) 67. Microchip's Focus Product Selector Guide includes information on specific packages that are available for each product. pcn dsg/03/380 dsg-discretes & standard ic s- leadfree plating for sop, tssop, ssop, qsop packages. Standard search with a direct link to product, package, and page content when applicable. All are specified for operation over the full -40°C to +85°C temperature range. The ACS764 is provided in a compact 24-pin QSOP package (suffix LF). 5-1mm beyond the standard size. Allowing the CE pin to float or applying a low logic level will enable the amplifier. Contribute to open-ephys/eagle-libraries development by creating an account on GitHub.